RESEARCH, DEVELOPMENT AN ENVIRONMENT-FRIENDLY COATING METHOD ON INSULATING SUBSTRATES

Abstract

In this paper, we demonstrate here that electroless deposition can be considered as an alternate efficient approach to metallize the surface of insulating substrates. Our electroless nickel plating requires only immersing the substrates into aqueous solutions in open air at low temperatures. Thin films of nickel alloy have been deposited electrolessly on KMPR surface, through a cost-effective and environmental chromium-free process, mediated through direct grafting of Palladium - Amine – Sillicon complexes in aqueous medium, without Acid Cromic. Covalent grafting and characterization of the deposited have been carried out by means of SEM, EDX, XPS techniques. The nickel film’s adhesion was tested in accordance with ASTMD standard of US.